IP Library › Assignment 013733/0178
Patent Assignment
Reel/Frame 013733/0178

Assignment of Assignor's Interest

Recorded: 2003-01-31 Pages: 6
Assignors
STEFANESCU, ANDREI D.
Executed: 2003-01-17
ROSIK, LEONARD O.
Executed: 2003-01-16
GARDNER, TINA L.
Executed: 2003-01-03
Assignee
MEMC ELECTRONIC MATERIALS, INC.
501 PEARL DRIVE, P.O. BOX 8, ST. PETERS, MISSOURI, 63376-5000
Covered Property (1)
Process for the Removal of Copper from Polished Boron-Doped Silicon Wafers
Application: 10/294,325 →
Publication: US 2003/0104680
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement Mar 19, 2003
From: MEMC ELECTRONIC MATERIALS, INC.; MEMC PASADENA, INC.; PLASMASIL, L.L.C.; SIBOND, L.L.C.
To: CITICORP USA, INC.
Reel/Frame 013964/0378 →