IP Library › Assignment 013736/0737
Patent Assignment
Reel/Frame 013736/0737

Assignment of Assignor's Interest

Recorded: 2003-02-06 Pages: 3
Assignor
NEC CORPORATION
Executed: 2003-01-17
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA, 211-8668, JAPAN
Covered Property (1)
Semiconductor Device and Method of Fabricating the Same
Patent: 6,849,539 →
Application: 10/124,389 →
Publication: US 2002/0155699
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Apr 18, 2002
From: UEDA, YASUHIKO
To: NEC CORPORATION; HITACHI, LTD.
Reel/Frame 012827/0086 →
Assignment of Assignor's Interest May 14, 2007
From: HITACHI, LTD.; NEC CORPORATION; NEC ELECTRONICS CORPORATION
To: ELPIDA MEMORY, INC.
Reel/Frame 019280/0844 →
Security Agreement Jul 29, 2013
From: PS4 LUXCO S.A.R.L.
To: ELPIDA MEMORY INC.
Reel/Frame 032414/0261 →
Assignment of Assignor's Interest May 15, 2014
From: ELPIDA MEMORY, INC.
To: PS4 LUXCO S.A.R.L.
Reel/Frame 032900/0568 →