Patent Assignment
Reel/Frame 013744/0255
Assignment of Assignor's Interest
Recorded: 2003-06-20
Pages: 3
Assignor
LEE, I TSENG
Executed: 2003-04-02
Assignee
VIA TECHNOLOGIES, INC.
8F, NO. 533, CHUNG-CHENG RD., HSIN-TIEN CITY, TAIPEI HSIEN, TAIWAN
Covered Property
(1)
[Chip Package and Process for Forming the Same]