Patent Assignment
Reel/Frame 013744/0482
Assignment of Assignor's Interest
Recorded: 2003-02-10
Pages: 4
Assignors
BRADY, MICHAEL D
Executed: 2003-01-14
MIRCEA, DESPA
Executed: 2003-01-15
HORN, KEITH A.
Executed: 2003-01-31
JOYDEEP, LAHIRI
Executed: 2003-01-29
JINLIN, PENG
Executed: 2003-01-13
ROOT, DAVID M.
Executed: 2003-01-04
STAMATOFF, JAMES B
Executed: 2003-01-23
WEBB, BRIAN L
Executed: 2003-01-17
Assignee
CORNING INCORPORATED
PATENT DEPT.; SP-TI-03-1, CORNING, NEW YORK, 14831
Covered Property
(1)
Microcolumn-Platform Based Array for High-Throughput Analysis
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.