IP Library Assignment 013753/0377
Patent Assignment
Reel/Frame 013753/0377

Assignment of Assignor's Interest

Recorded: 2003-06-23 Received: 2003-06-23 Pages: 10
Assignor
NEC CORPORATION
Executed: 2002-11-01
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA, JPX, 211-8668, JAPAN
Covered Property (1)
Method of Making a Semiconductor Device with Alloy Film Between Barrier Metal and Interconnect
Application: 10/212,739 →