Patent Assignment
Reel/Frame 013753/0377
Assignment of Assignor's Interest
Recorded: 2003-06-23
Received: 2003-06-23
Pages: 10
Assignor
NEC CORPORATION
Executed: 2002-11-01
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA, JPX, 211-8668, JAPAN
Covered Property
(1)
Method of Making a Semiconductor Device with Alloy Film Between Barrier Metal and Interconnect
Application:
10/212,739 →