Patent Assignment
Reel/Frame 013753/0662
Assignment of Assignor's Interest
Recorded: 2003-02-13
Received: 2003-02-19
Pages: 3
Assignor
NEC CORPORATION
Executed: 2002-11-01
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA, JPX, 211-8668, JAPAN
Covered Properties
(12)
Levenson Phase Shift Mask and Method for Forming Fine Pattern by Using the Same
Application:
10/277,512 →
Integrated Circuit and Manufacturing Method Therefor
Application:
10/273,161 →
Integrated Circuit Including an Inductor, Active Layers with Isolation Dielectrics, and Multiple Insulation Layers
Application:
10/273,313 →
Magnetic Memory and Method of Its Manufacture
Application:
10/271,007 →
Semiconductor Device Having Reinforced Coupling Between Solder Balls and Substrate
Application:
10/256,364 →
Wiring substrate for small electronic component and manufacturing method
Application:
10/253,295 →
Manufacturing method of semiconductor device
Application:
10/237,770 →
Flip Chip Type Semiconductor Device and Method of Manufacturing the Same
Application:
10/233,219 →
System Clock Synchronization Circuit
Application:
10/228,653 →
Low-Amplitude Driver Circuit
Application:
10/223,807 →
Method of Making Loadless Four-Transistor Mrmory Cell with Different Gate Insulation Thicknesses for N-Channel Drive Transistors and P-Channel Access Transistors
Application:
10/212,658 →
Chip Manufacturing Method for Cutting Test Pads from Integrated Circuits by Sectioning Circuit Chips from Circuit Substrate
Application:
10/208,496 →