IP Library Granted Patent US 6,686,224
Granted Patent Utility
US 6,686,224 · Confirmation No. 5430

CHIP MANUFACTURING METHOD FOR CUTTING TEST PADS FROM INTEGRATED CIRCUITS BY SECTIONING CIRCUIT CHIPS FROM CIRCUIT SUBSTRATE

Inventor: Kunihiko Higashi
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Code Description Pages PDF
2003-12-15 IFEE Issue Fee Payment (PTO-85B) 2 View
2002-07-30 TRNA Transmittal of New Application 2 View
2002-07-30 SPEC Specification 17 View
2002-07-30 CLM Claims 10 View
2002-07-30 ABST Abstract 1 View
2002-07-30 DRW Drawings-only black and white line drawings 6 View
2002-07-30 OATH Oath or Declaration filed 2 View
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Quick Facts
Patent No.
US 6,686,224
App. No.
10/208,496
Filed
2002-07-30
Granted
2004-02-03
Pub. No.
US20030049871A1
Art Unit
2813
PTA
0 days