Patent Assignment
Reel/Frame 025486/0561
Change of Name
Recorded: 2010-12-13
Received: 2010-12-13
Pages: 9
Assignor
NEC ELECTRONICS CORPORATION
Executed: 2010-04-01
Assignee
RENESAS ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU,, KAWASAKI-SHI, KANAGAWA, JPX, 211-8668, JAPAN
Covered Properties
(92)
One-Shot Signal Generation Circuit
Application:
10/221,249 →
Semiconductor Memory Device
Application:
10/220,951 →
Method of Making a Non-Volatile Semiconductor Memory Device
Application:
10/233,616 →
Semiconductor Memory Device Including Shadow Ram
Application:
10/232,672 →
High Speed Sampling Receiver with Reduced Output Impedance
Application:
10/232,657 →
Method of Manufacturing Semiconductor Device
Application:
10/232,532 →
Method of Forming Metal Wiring Line Including Using a First Insulating Film as a Stopper Film
Application:
10/231,175 →
Semiconductor Device Incorporating Hemispherical Solid Immersion Lens, Apparatus and Method for Manufacturing the Same
Application:
10/230,490 →
Semiconductor Device Having the Effect That the Drop in the Current Gain Is Kept to the Minimum, When the Substrate Density Is Amplified and That the Variation in the Collector Current Is Improved
Application:
10/230,095 →
Semiconductor Integrated Circuit and Its Layout Method
Application:
10/230,197 →
Semiconductor Device Incorporating Hemispherical Solid Immersion Lens, Apparatus and Method for Manufacturing the Same
Application:
10/230,491 →
Semiconductor Device Having Smooth Refractory Metal Silicide Layers and Process for Fabrication Thereof
Application:
10/229,144 →
System Clock Synchronization Circuit
Application:
10/228,653 →
Path Detection Apparatus in Cdma Reception Device
Application:
10/226,017 →
Clock Control Method, Frequency Dividing Circuit and Pll Circuit
Application:
10/225,361 →
Semiconductor Device Capable of Internally Generating Bias Changing Signal
Application:
10/225,865 →
Low-Amplitude Driver Circuit
Application:
10/223,807 →
Semiconductor Integrated Circuit Having Reduced Crosstalk Interference on Clock Signals
Application:
10/222,906 →
Method of Making Semiconductor Device in Which Memory Cells and Peripheral Circuits Are on the Same Substrate
Application:
10/222,557 →
Flip Chip Semiconductor Integrated Circuit
Application:
10/219,194 →
Heterojunction Bipolar Transistor and Semiconductor Integrated Circuit Device Using the Same
Application:
10/218,775 →
Solid State Image Sensor and Method for Fabricating the Same
Application:
10/214,301 →
Method of Making a Semiconductor Device with Alloy Film Between Barrier Metal and Interconnect
Application:
10/212,739 →
Method of Making Loadless Four-Transistor Mrmory Cell with Different Gate Insulation Thicknesses for N-Channel Drive Transistors and P-Channel Access Transistors
Application:
10/212,658 →
Image Display Device and Method for Driving the Same
Application:
10/212,452 →
Data Separation and Decoding Device
Application:
10/209,273 →
Stripping Composition
Application:
10/208,796 →
Sealing Resin, Resin-Sealed Semiconductor and System-In-Package
Application:
10/210,770 →
Semiconductor Device
Application:
10/210,157 →
Flip-Flop Circuit
Application:
10/210,748 →
Lead Frame and Semiconductor Device Having the Same as Well as Method of Resin-Molding the Same
Application:
10/207,055 →
Chip Manufacturing Method for Cutting Test Pads from Integrated Circuits by Sectioning Circuit Chips from Circuit Substrate
Application:
10/208,496 →
Bipolar Transistor with Divided Base and Emitter Regions
Application:
10/206,055 →
Data Processor Using Indirect Register Addressing
Application:
10/206,058 →
Semiconductor Integrated Circuit and Liquid Crystal Display Device
Application:
10/201,969 →
Semiconductor Integrated Circuit Device
Application:
10/201,284 →
Semiconductor Device
Application:
10/199,592 →
Flip-Flop and Scan Path Circuit
Application:
10/197,583 →
Manufacturing Method of Semiconductor Device
Application:
10/197,670 →
Semiconductor Device and Method for Manufacturing the Same
Application:
10/196,430 →
Failure Propagation Path Estimate System
Application:
10/194,773 →
Semiconductor Device and Wire Bonding Method Therefor
Application:
10/194,142 →
Method of Washing a Semiconductor Wafer
Application:
10/192,728 →
Digital Phase Control Circuit
Application:
10/191,075 →
Method and Apparatus for Chemical-Mechanical Polishing
Application:
10/190,016 →
Matrix Switch Device High in Isolation Between Terminals Thereof, Small in Size, and Low in Manufacturing Cost
Application:
10/190,325 →
Voltage Amplifying Circuit
Application:
10/189,140 →
Semiconductor Integrated Circuit
Application:
10/189,261 →
Optical Disk Device Using a New Alternate List for Defect Correction
Application:
10/186,586 →
Semiconductor Integrated Circuit Having Macro Cells and Designing Method of the Same
Application:
10/185,394 →
Cylinder Cabinet and Method of Purging Remaining Gas in the Pipe Thereof
Application:
10/180,497 →
Semiconductor Device
Application:
10/180,602 →
Bonding Tool Capable of Bonding Inner Leads of Tab Tapes to Electrode Pads in High Quality and High Productivity and Bonding Method
Application:
10/179,907 →
Semiconductor Device with Soi Structure and Method of Manufacturing the Same
Application:
10/178,429 →
Semiconductor Device Having an Esd Protective Circuit
Application:
10/178,657 →
Dual Damascene Circuit with Upper Wiring and Interconnect Line Positioned in Regions Formed as Two Layers Including Organic Polymer Layer and Low-Permittivity Layer
Application:
10/177,667 →
Method of Manufacturing Non-Volatile Semiconductor Memory Device
Application:
10/177,280 →
Electrically Conductive Paste and Semiconductor Device Prepared by Using the Paste
Application:
10/176,377 →
Delay Adjustment Circuit for Delay Locked Loop
Application:
10/178,660 →
Image Sensor
Application:
10/173,874 →
Method of Manufacturing a Semiconductor Device and Designing a Mask Pattern
Application:
10/173,037 →
Semiconductor Memory Device
Application:
10/173,049 →
Semiconductor Device
Application:
10/170,842 →
Cleaning Water for Cleaning a Wafer and Method of Cleaning a Wafer
Application:
10/167,442 →
Semiconductor Device Having a Thin Film Capacitor of a Mim (Metal-Insulator-Metal) Structure
Application:
10/170,813 →
Semiconductor Package Having a Resin Cap Member
Application:
10/166,668 →
Method of Forming Wiring Structure by Using Photo Resist Having Optimum Development Rate
Application:
10/166,362 →
Method of Manufacturing Semiconductor Devices and Semiconductor Manufacturing Apparatus
Application:
10/166,303 →
Semiconductor Device with Vertical Mosfet
Application:
10/164,640 →
Linear Transconductance Amplifier
Application:
10/164,742 →
Linear Transconductance Amplifier
Application:
10/164,745 →
Linear Transconductance Amplifier
Application:
10/164,746 →
Non-Volatile Storage Device and Rewrite Control Method Thereof
Application:
10/164,657 →
Semiconductor Device and Method of Fabricating the Same
Application:
10/163,984 →
Variable Impedance Circuit
Application:
10/164,510 →
Mask Rom and Method for Manufacturing the Same
Application:
10/161,650 →
Complementary Signal Generation Circuit
Application:
10/162,170 →
Method of Manufacturing Semiconductor Device
Application:
10/164,130 →
Predistortion Type Linearizer Controlled by Two Control Voltages
Application:
10/162,297 →
Method for Producing Thin Film
Application:
10/162,728 →
Data Processing Apparatus with Circuit for Confirming Normality of Serial Transmission Data
Application:
10/159,500 →
Buffer Circuit Capable of Carrying Out Interface with a High Speed
Application:
10/155,976 →
Semiconductor Storage and Method for Testing the Same
Application:
10/148,430 →
Overlapped Field Detecting Apparatus Capable of Detecting Non-Overlapped Fields Mostly Overlapped
Application:
10/157,614 →
Method for Vapor Deposition of a Metal Compound Film
Application:
10/147,977 →
Comparator and Analog-to-Digital Converter
Application:
10/151,415 →
Semiconductor Device
Application:
10/151,416 →
Clock Control Circuit
Application:
10/146,827 →
Method of Manufacturing a Semiconductor Device
Application:
10/146,049 →
False Path Detecting Apparatus and a False Path Detecting Method in Which a Usage Amount of Memories Is Smaller and a Process Is Carried Out at a Higher Speed, and That Program
Application:
10/146,678 →
Graphics Engine, and Display Driver Ic and Display Module Incorporating the Graphics Engine
Application:
10/141,797 →
Resin-Molded Package with Cavity Structure
Application:
10/144,313 →