Semiconductor package having a resin cap member

1. A method for manufacturing a semiconductor package, comprising:

forming a curable resin layer;

forming a package substrate including a cavity therein, said cavity including a top opening and receiving therein a semiconductor chip;

placing said package substrate onto said curable resin layer with said top opening being closed by said curable resin layer; and

curing said curable resin layer to form a cap member encapsulating said semiconductor chip in said cavity.

2. The method according to claim 1 , wherein said forming a curable resin layer includes using a squeezer.

3. The method according to claim 1 , wherein said cavity comprises a plurality of cavities arranged in a matrix, each of said plurality of cavities receiving therein one of a plurality of semiconductor chips.

4. The method according to claim 3 , wherein said forming a curable resin layer includes using a mold die with a flat depression.

5. The method according to claim 3 , wherein said plurality of cavities is closed by said curable resin layer.

6. The method according to claim 3 , wherein said curable resin layer comprises a plurality of curable resin layers, each of said plurality of curable resin layers corresponding to one of said plurality of cavities.

7. The method according to claim 6 , wherein said plurality of curable resin layers are formed in a corresponding plurality of depressions in said mold die.

8. The method according to claim 1 , wherein said package substrate includes a wiring board and a wall substrate mounted on said wiring board to form said cavity.

9. The method according to claim 1 , wherein said package substrate includes a lead frame array including a plurality of die pads, and a curable resin layer including a plurality of depressions, each of said plurality of depressions receiving therein one of said plurality of die pads.

10. The method according to claim 1 , wherein said curable resin layer comprises a thermosetting resin layer.

11. The method according to claim 10 , wherein said curing allows said cap member to comprise a concave inner surface.

12. The method according to claim 3 , wherein between adjacent cavities of said plurality of cavities is formed a wall member including a groove extending along a scribe line.

13. A semiconductor package, comprising:

a base member;

a wall member fixed onto said base member, thereby forming a cavity, said cavity including a top opening and receiving therein a semiconductor chip; and

a cured-resin cap member which is bonded onto a top of said wall member and which is disposed on said top opening for encapsulating said semiconductor chip in said cavity, said cavity containing air around said semiconductor chip,

wherein said cavity comprises a plurality of cavities arranged in a matrix and each of said plurality of cavities receives therein one of a plurality of semiconductor chips, and

wherein said base member includes a lead frame array including a plurality of lead frames and a plurality of depressions, each of said plurality of depressions receiving therein one of a plurality of die pads.

14. A method for manufacturing a semiconductor package, comprising:

forming a curable resin layer;

forming a package substrate including a cavity;

placing said package substrate onto said curable resin layer, said curable resin layer capping said cavity; and

curing said curable resin layer to form a cap.

15. A semiconductor package, comprising:

a base member;

a wall member fixed onto said base member, thereby forming a cavity, said cavity including a top opening and receiving therein a semiconductor chip; and

a cured-resin cap member, which includes a concave inner surface, for closing said top opening to encapsulate said semiconductor chip in said cavity,

wherein said cured-resin cap member includes a concave inner surface,

wherein said cavity includes air around said semiconductor chip.

16. The semiconductor package according to claim 15 , wherein said base member and said wall member comprise a curable resin.

17. The semiconductor package according to claim 14 , wherein said cavity includes air around a semiconductor chip, which is encapsulated by said curable resin.