IP Library Assignment 013001/0687
Patent Assignment
Reel/Frame 013001/0687

Assignment of Assignor's Interest

Recorded: 2002-06-13 Pages: 3
Assignor
KANATAKE, MITSUHITO
Executed: 2002-06-10
Assignee
NEC COMPOUND SEMICONDUCTOR DEVICES, LTD.
1753 SHIMONUMABE, NAKAHARU-KU, KAWASAKI-SHI, KANAGAWA 211-8666, JAPAN
Covered Property (1)
Semiconductor Package Having a Resin Cap Member
Patent: 7,060,530 →
Application: 10/166,668 →
Publication: US 2002/0190266
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Apr 14, 2006
From: NEC COMPOUND SEMICONDUCTOR DEVICES, LTD.
To: NEC ELECTRONICS CORPORATION
Reel/Frame 017765/0215 →
Change of Name Dec 13, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025486/0561 →