IP Library › Assignment 017765/0215
Patent Assignment
Reel/Frame 017765/0215

Assignment of Assignor's Interest

Recorded: 2006-04-14 Pages: 4
Assignor
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA, 211-8668, JAPAN
Covered Property (1)
Semiconductor Package Having a Resin Cap Member
Patent: 7,060,530 →
Application: 10/166,668 →
Publication: US 2002/0190266
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 13, 2002
From: KANATAKE, MITSUHITO
To: NEC COMPOUND SEMICONDUCTOR DEVICES, LTD.
Reel/Frame 013001/0687 →
Change of Name Dec 13, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025486/0561 →