Patent Assignment
Reel/Frame 013160/0093
Assignment of Assignor's Interest
Recorded: 2002-07-30
Pages: 2
Assignor
HIGASHI, KUNIHIKO
Executed: 2002-07-12
Assignee
NEC CORPORATION
7-1, SHIBA 5-CHOME MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Chip Manufacturing Method for Cutting Test Pads from Integrated Circuits by Sectioning Circuit Chips from Circuit Substrate
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Feb 13, 2003
From: NEC CORPORATION
To: NEC ELECTRONICS CORPORATION
Reel/Frame 013753/0662 →
Change of Name
Dec 13, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025486/0561 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →