Granted Patent
Utility
US 6,686,224 · App. 10/208,496
Chip manufacturing method for cutting test pads from integrated circuits by sectioning circuit chips from circuit substrate
Inventor:
Kunihiko Higashi
Patented Case
View Patent ↗
Granted: Feb 3, 2004
Filed: Jul 30, 2002
Inventor
Kunihiko Higashi
Assignee (at issue)
NEC Electronics Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.