Patent Assignment
Reel/Frame 013756/0845
Assignment of Assignor's Interest
Recorded: 2003-02-07
Pages: 5
Assignors
KANG, TAE-HYEOG
Executed: 2003-01-24
PARK, SANG-KAB
Executed: 2003-01-24
YOON, KWANG-HO
Executed: 2003-01-24
CHOI, BONG-KYU
Executed: 2003-01-24
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
314, MAETAN-3DONG, PALDAL-GU, SUWON-SI, KYUNGGI-DO, 442-743, KOREA, REPUBLIC OF
Covered Property
(1)
Method for Plating of Printed Circuit Board Strip