IP Library › Assignment 013759/0502
Patent Assignment
Reel/Frame 013759/0502

Assignment of Assignor's Interest

Recorded: 2003-02-21 Pages: 2
Assignor
KASPERCHIK, VLADEK
Executed: 2003-01-06
Assignee
HEWLETT-PACKARD COMPANY
INTELLECTUAL PROPERTY ADMINISTRATION, P.O. BOX 272400, FORT COLLINS, CALIFORNIA, 80527-2400
Covered Property (1)
Freeform Fabrication Low Density Material Systems
Patent: 7,309,728 →
Application: 10/339,824 →
Publication: US 2004/0161544
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 18, 2003
From: HEWLETT-PACKARD COMPANY
To: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Reel/Frame 013776/0928 →