Patent Assignment
Reel/Frame 013762/0251
Assignment of Assignor's Interest
Recorded: 2003-06-27
Pages: 3
Assignors
ALLEN, DUANE E
Executed: 2003-06-17
BURNOR, BRIAN K
Executed: 2003-06-19
DOTOLO, THOMAS A
Executed: 2003-06-25
GARDECKI, LEONARD J
Executed: 2003-06-19
HAMMOND, WILLIAM L
Executed: 2003-06-17
HORSFORD, KIBBY B
Executed: 2003-06-17
RAMSEY, CHARLES R
Executed: 2003-06-19
Assignee
INTERNATIONAL BUSINESS MACHINES
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
Mask and Substrate Alignment for Solder Bump Process