IP Library › Assignment 013792/0372
Patent Assignment
Reel/Frame 013792/0372

Assignment of Assignor's Interest

Recorded: 2002-11-25 Pages: 2
Assignors
TERASAWA, TSUNEO
Executed: 2002-10-07
TANAKA, TOSHIHIKO
Executed: 2002-10-11
MIYAZAKI, KO
Executed: 2002-10-22
HASEGAWA, NORIO
Executed: 2002-10-11
MORI, KAZUTAKA
Executed: 2002-10-16
Assignee
HITACHI, LTD.
6, KANDA SURUGADAI 4-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property (1)
Method of Fabricating Semiconductor Integrated Circuit Device and Method of Producing a Multi-Chip Module That Includes Patterning with a Photomask That Uses Metal for Blocking Exposure Light and a Photomask That Uses Organic Resin for Blocking Exposure Light
Patent: 6,849,540 →
Application: 10/296,495 →
Publication: US 2003/0109126
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 1, 2003
From: HITACHI, LTD.
To: RENESAS TECHNOLOGY CORPORATION
Reel/Frame 014573/0096 →
Assignment of Assignor's Interest Nov 28, 2006
From: HITACHI, LTD.
To: RENESAS TECHNOLOGY CORPORATION
Reel/Frame 018559/0281 →
Merger Sep 10, 2010
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 024982/0148 →