Patent Assignment
Reel/Frame 013795/0288
Assignment of Assignor's Interest
Recorded: 2003-03-03
Received: 2003-03-04
Pages: 3
Assignor
NEC CORPORATION
Executed: 2002-11-01
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA 211-8668, JPX, JAPAN
Covered Properties
(7)
Semiconductor Memory and Control Method
Application:
10/333,935 →
Method of Manufacturing Semiconductor Device
Application:
10/303,275 →
Method of Fabricating Semiconductor Device with Lower Layer Wiring and via Hole
Application:
10/274,555 →
Semiconductor Storage Device
Application:
10/258,334 →
Semiconductor Storage Device
Application:
10/257,193 →
Solder Ball and Interconnection Structure Using the Same
Application:
10/255,373 →
Semiconductor device and process for production thereof
Application:
10/252,898 →