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App. No. 10/255,373 · Confirmation No. 1215

SOLDER BALL AND INTERCONNECTION STRUCTURE USING THE SAME

Inventor: Tomoko Harada
Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362 View Patent ↗ View Publication ↗
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2004-08-12 IFEE Issue Fee Payment (PTO-85B) 2 View
2004-05-20 NOA Notice of Allowance and Fees Due (PTOL-85) 3 View
2004-05-20 NOA Notice of Allowance and Fees Due (PTOL-85) 2 View
2004-05-20 892 List of references cited by examiner 1 View
2004-05-20 IIFW Issue Information including classification, examiner, name, claim, renumbering, etc. 1 View
2004-05-20 SRFW Search information including classification, databases and other search related notes 1 View
2003-11-18 CFILE Request for Corrected Filing Receipt 3 View
2002-10-22 LET. Miscellaneous Incoming Letter 1 View
2002-10-22 DRW Drawings-only black and white line drawings 5 View
2002-10-22 FRPR Certified Copy of Foreign Priority Application 28 View
2002-09-26 TRNA Transmittal of New Application 2 View
2002-09-26 SPEC Specification 27 View
2002-09-26 CLM Claims 4 View
2002-09-26 ABST Abstract 1 View
2002-09-26 DRW Drawings-only black and white line drawings 5 View
2002-09-26 OATH Oath or Declaration filed 1 View
2002-09-26 WFEE Fee Worksheet (SB06) 1 View
2002-09-26 WFEE Fee Worksheet (SB06) 1 View
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Quick Facts
App. No.
10/255,373
Filed
2002-09-26
Granted
2004-09-21
Pub. No.
US20030060066A1
Art Unit
1725
PTA
0 days