Assignment of Assignor's Interest

Recorded: 2002-09-26 Pages: 2

Assignor

HARADA, TOMOKO

Executed: 2002-09-20

Assignee

NEC CORPORATION

7-1 SHIBA 5-CHOME, MINATO-KU, TOKYO, JAPAN

Covered Property (1)

Solder Ball and Interconnection Structure Using the Same

Patent: 6,793,116 →

Application: 10/255,373 →

Publication: US 2003/0060066

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.