Patent Assignment
Reel/Frame 013832/0115
Assignment of Assignor's Interest
Recorded: 2003-07-28
Pages: 2
Assignees
NEC ELECTRONICS CORPORATION
1753 SHIMONUMANBE, NAKAHARA-KU, KAWASAKI-SHI, KANAGAWA, JAPAN
ELPIDA MEMORY, INC.
2-1, YAESU 2-CHOME, CHUO-KU, TOKYO, JAPAN
Covered Property
(1)
Semiconductor Device Without Adverse Effects Caused by Inclinations of Word Line and Bit Line
Related Assignments
(7)
Other recorded transfers of the patent in this record — the chain of ownership.
Re-Record to Correct the Address of the First Receiving Party, Previously Recorded at Reel 13832, Frames 115-116.
Aug 14, 2003
From: SEKINE, JUNICHI; ISHIZUKA, KAZUTERU
To: NEC ELECTRONICS CORPORATION; ELPIDA MEMORY, INC.
Reel/Frame 014386/0740 →
Change of Name
Dec 22, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025525/0154 →
Security Interest
May 12, 2016
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 038669/0001 →
Patent Security Agreement
Jun 2, 2016
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 038954/0001 →
Corrective Assignment to Correct the Replace Erroneously Filed Patent #7358718 with the Correct Patent #7358178 Previously Recorded on Reel 038669 Frame 0001. Assignor(S) Hereby Confirms the Security Interest.
Jun 8, 2017
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 043079/0001 →
Release of Security Interest
Aug 23, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 047243/0001 →
Release of Security Interest
Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050937/0001 →