IP Library › Assignment 013844/0360
Patent Assignment
Reel/Frame 013844/0360

Assignment of Assignor's Interest

Recorded: 2003-03-05 Pages: 2
Assignors
YEO, YEE-CHIA
Executed: 2003-03-05
LEE, WEN-CHIN
Executed: 2003-03-05
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
121 PARK AVENUE 3, SCIENCED-BASED INDUSTRIAL PARK, HSIN-CHU, 300, TAIWAN
Covered Property (1)
Method of Forming Strained Silicon on Insulator Substrate
Patent: 6,911,379 →
Application: 10/379,873 →
Publication: US 2004/0173790