Patent Assignment
Reel/Frame 013866/0744
Assignment of Assignor's Interest
Recorded: 2003-03-17
Pages: 2
Assignee
NITTO DENKO CORPORATION
1-2, SHIMOHOZUMI 1-CHOME, IBARAKA-SHI, OSAKA, 567-8680, JAPAN
Covered Property
(1)
Semiconductor Wafer Transport Method and Semiconductor Wafer Transport Apparatus Using the Same