Patent Assignment
Reel/Frame 013914/0175
Assignment of Assignor's Interest
Recorded: 2003-03-26
Pages: 2
Assignors
KONDO, SEIICHI
Executed: 2001-03-21
SAKUMA, NORIYUKI
Executed: 2001-03-29
HOMMA, YOSHIO
Executed: 2001-03-30
Assignee
HITACHI, LTD.
6, KANDA SURUGADAI 4-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property
(1)
Methods of Polishing, Interconnect-Fabrication, and Producing Semiconductor Devices
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 1, 2003
From: HITACHI, LTD.
To: RENESAS TECHNOLOGY CORPORATION
Reel/Frame 014573/0096 →
Assignment of Assignor's Interest
Nov 28, 2006
From: HITACHI, LTD.
To: RENESAS TECHNOLOGY CORPORATION
Reel/Frame 018559/0281 →
Merger
Jul 7, 2010
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 024662/0280 →