Patent Assignment
Reel/Frame 013915/0449
Assignment of Assignor's Interest
Recorded: 2003-03-26
Pages: 3
Assignors
YAMAMOTO, KENICHI
Executed: 2003-02-17
MORITA, TOSHIAKI
Executed: 2003-02-19
YAMADA, MUNEHIRO
Executed: 2003-02-18
KIMOTO, RYOSUKE
Executed: 2003-02-18
Assignee
HITACHI, LTD.
6, KANDA SURUGADAI 4-CHOME CHIYODA, TOKYO, JAPAN
Covered Property
(1)
Semiconductor Device with Joint Structure Having Lead-Free Solder Layer Over Nickel Layer
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 11, 2003
From: HITACHI, LTD.
To: RENESAS TECHNOLOGY CORPORATION
Reel/Frame 014190/0088 →
Change of Name
Aug 13, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 024864/0635 →
Merger
Aug 13, 2010
From: RENESAS TECHNOLOGY CORP.
To: NEC ELECTRONICS CORPORATION
Reel/Frame 024879/0190 →
Assignment of Assignor's Interest
May 9, 2014
From: HITACHI ULSI SYSTEMS CO., LTD.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 032859/0252 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →