IP Library › Assignment 013932/0167
Patent Assignment
Reel/Frame 013932/0167

Assignment of Assignor's Interest

Recorded: 2003-03-31 Pages: 3
Assignors
RUELKE, HARTMUT
Executed: 2002-12-03
HOHAGE, JOERG
Executed: 2002-12-03
WERNER, THOMAS
Executed: 2002-12-03
Assignee
ADVANCED MICRO DEVICES, INC.
5204 E. BEN WHITE BLVD., AUSTIN, TEXAS, 78741
Covered Property (1)
Barrier Layer for a Copper Metallization Layer Including a Low K Dielectric
Patent: 6,893,956 →
Application: 10/403,483 →
Publication: US 2004/0084680