IP Library Assignment 013934/0568
Patent Assignment
Reel/Frame 013934/0568

Assignment of Assignor's Interest

Recorded: 2003-03-31 Pages: 3
Assignors
HU, CHUAN
Executed: 2003-03-28
EMERY, RICHARD D.
Executed: 2003-03-28
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95052
Covered Property (1)
Package with Integrated Wick Layer and Method for Heat Removal
Patent: 7,095,111 →
Application: 10/403,645 →
Publication: US 2004/0188829