Patent Assignment
Reel/Frame 013935/0572
Assignment of Assignor's Interest
Recorded: 2003-03-31
Pages: 13
Assignors
FARNWORTH, WARREN M.
Executed: 2003-03-05
WOOD, ALAN G.
Executed: 2003-03-05
HIATT, WILLIAM M.
Executed: 2003-03-05
WARK, JAMES M.
Executed: 2003-03-05
HEMBREE, DAVID R.
Executed: 2003-03-05
KIRBY, KYLE K.
Executed: 2003-03-05
BENSON, PETE A.
Executed: 2003-03-05
Assignee
MICRON TECHNOLOGY, INC.
8000 SOUTH FEDERAL WAY, LEGAL DEPARTMENT, M/S 525, BOISE, IDAHO, 83706
Covered Property
(1)
Multi-Dice Chip Scale Semiconductor Components and Wafer Level Methods of Fabrication
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.