Patent Assignment
Reel/Frame 013951/0701
Assignment of Assignor's Interest
Recorded: 2003-04-03
Pages: 3
Assignor
WANG, SUNG-HSIUNG
Executed: 2003-01-07
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO. LTD.
NO. 121 PARK AVENUE 3, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, R.O.C., TAIWAN
Covered Property
(1)
Method for Forming Thick Copper Self-Aligned Dual Damascene