Patent Assignment
Reel/Frame 013971/0194
Assignment of Assignor's Interest
Recorded: 2003-04-14
Pages: 3
Assignors
HASHIMOTO, CHIEMI
Executed: 2003-03-18
KAWASHIMA, YASUHIKO
Executed: 2003-03-25
KAWAKITA, KEIZO
Executed: 2003-03-19
MONIWA, MASAHIRO
Executed: 2003-03-24
ISHIZUKA, HIROYASU
Executed: 2003-03-19
SHIMIZU, AKIHIRO
Executed: 2003-03-25
Assignees
HITACHI, LTD.
6, KANDA SURUGADAI 4-CHOME, CHIYODA-KU, TOKYO, JAPAN
HITACHI ULSI SYSTEMS CO. LTD.
22-1, JOSUIHONCHO 5-CHOME, KODAIRA-SHI, TOKYO, JAPAN
ELPIDA MEMORY, INC.
2-1, YAESU 2-CHOME, CHUO-KU, TOKYO, JAPAN
Covered Property
(1)
Semiconductor Integrated Circuit Device and Manufacturing Method Thereof
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 26, 2003
From: HITACHI, LTD.
To: RENESAS TECHNOLOGY CORPORATION
Reel/Frame 014559/0815 →
Assignment of Assignor's Interest
Aug 9, 2004
From: RENESAS TECHNOLOGY CORP.
To: HITACHI, LTD.
Reel/Frame 015057/0459 →
Assignment of Assignor's Interest
Dec 12, 2006
From: HITACHI, LTD.; HITACHI ULSI SYSTEMS CO., LTD.
To: ELPIDA MEMORY, INC.
Reel/Frame 018668/0219 →
Security Agreement
Jul 29, 2013
From: PS4 LUXCO S.A.R.L.
To: ELPIDA MEMORY INC.
Reel/Frame 032414/0261 →
Assignment of Assignor's Interest
May 15, 2014
From: ELPIDA MEMORY, INC.
To: PS4 LUXCO S.A.R.L.
Reel/Frame 032900/0568 →