Patent Assignment
Reel/Frame 014005/0087
Assignment of Assignor's Interest
Recorded: 2003-04-25
Pages: 3
Assignors
UTSUMI, SHIGERU
Executed: 2003-04-08
FUJIOKA, HIROFUMI
Executed: 2003-04-08
OKA, SEIJI
Executed: 2003-04-08
TSURUSE, HIDEKI
Executed: 2003-04-08
KASE, TAICHI
Executed: 2003-04-08
MURAKI, TAKESHI
Executed: 2003-04-08
Assignee
MITSUBISHI DENKI KABUSHIKI KAISHA
2-3, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, 100-8310, JAPAN
Covered Property
(1)
Wiring Board, Fabrication Method of Wiring Board, and Semiconductor Device