Patent Assignment
Reel/Frame 014011/0029
Assignment of Assignor's Interest
Recorded: 2003-09-26
Pages: 3
Assignors
LEE, KONG WENG
Executed: 2003-06-26
NG, KEE YEAN
Executed: 2003-06-26
KUAN, YEW CHEONG
Executed: 2003-06-26
TAN, GIN GHEE
Executed: 2003-06-26
TAN, CHENG WHY
Executed: 2003-06-26
Assignee
AGILENT TECHNOLOGIES, INC.
LEGAL DEPARTMENT, DL429, INTELLECTUAL PROPERTY ADMINISTRATION, P.O. BOX 7599, LOVELAND, COLORADO, 80537-0599
Covered Property
(1)
Method for Fabricating a Packaging Device for Semiconductor Die and Semiconductor Device Incorporating Same
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Feb 22, 2006
From: AGILENT TECHNOLOGIES, INC.
To: AVAGO TECHNOLOGIES GENERAL IP PTE. LTD.
Reel/Frame 017206/0666 →
Assignment of Assignor's Interest
May 25, 2006
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES ECBU IP (SINGAPORE) PTE. LTD.
Reel/Frame 017675/0518 →
Assignment of Assignor's Interest
Sep 17, 2012
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.; AVAGO TECHNOLOGIES ECBU IP (SINGAPORE) PTE. LTD.; AVAGO TECHNOLOGIES FIBER IP (SINGAPORE) PTE. LTD.
To: INTELLECTUAL DISCOVERY CO., LTD.
Reel/Frame 028972/0733 →
Corrective Assignment to Correct the Assignee Name Previously Recorded at Reel: 017206 Frame: 0666. Assignor(S) Hereby Confirms the Assignment.
May 6, 2016
From: AGILENT TECHNOLOGIES, INC.
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 038632/0662 →
Assignment of Assignor's Interest
Nov 17, 2016
From: INTELLECTUAL DISCOVERY CO. LTD.
To: DOCUMENT SECURITY SYSTEMS, INC.
Reel/Frame 040744/0174 →