Patent Assignment
Reel/Frame 014016/0451
Assignment of Assignor's Interest
Recorded: 2003-02-25
Pages: 3
Assignee
IBIDEN CO., LTD.
1, KANDA-CHO 2-CHOME, OGAKI-SHI, GIFU 503-0917, JAPAN
Covered Property
(1)
Semiconductor Chip Mounting Wiring Board, Manufacturing Method for Same, and Semiconductor Module