Patent Assignment
Reel/Frame 014044/0506
Assignment of Assignor's Interest
Recorded: 2003-05-01
Pages: 3
Assignors
WANG, WEI D.
Executed: 2003-04-24
SUBRAMANI, ANANTHA K.
Executed: 2003-04-28
FU, JIANMING
Executed: 2003-04-25
GOPALRAJA, PRABURAM
Executed: 2003-04-29
YU, JICK M.
Executed: 2003-04-25
CHEN, FUSEN
Executed: 2003-04-30
Assignee
APPLIED MATERIALS, INC.
P.O. BOX 450A, PATENT / LEGAL DEPARTMENT - M/S 2061, SANTA CLARA, CALIFORNIA, 95052
Covered Property
(1)
Partially Filling Copper Seed Layer