Patent Assignment
Reel/Frame 014062/0967
Assignment of Assignor's Interest
Recorded: 2003-05-08
Pages: 5
Assignees
TOKYO ELECTRON LIMITED
3-6 AKASAKA 5-CHOME, MINATO-KU, TOKYO-TO, JAPAN
SONY CORPORATION
7-35, KITASHINAGAWA 6-CHOME, SHINAGAWA-KU, TOKYO-TO, JAPAN
Covered Property
(1)
Substrate Processing Apparatus and Substrate Processing Method