Patent Assignment
Reel/Frame 014076/0430
Assignment of Assignor's Interest
Recorded: 2003-05-13
Pages: 2
Assignor
SIDHWA, ARDESHIR J.
Executed: 2003-05-13
Assignee
STMICROELECTRONICS, INC.
1310 ELECTRONICS DRIVE, CARROLLTON, TEXAS, 75006
Covered Property
(1)
Method and Structure of a Thick Metal Layer Using Multiple Deposition Chambers