Patent Assignment
Reel/Frame 014079/0753
Assignment of Assignor's Interest
Recorded: 2003-05-14
Pages: 3
Assignors
KIM, JAE-HAK
Executed: 2003-05-06
LEE, SOO-GEUN
Executed: 2003-05-06
PARK, KI-KWAN
Executed: 2003-05-06
LEE, KYOUNG-WOO
Executed: 2003-05-06
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, PALDAL-GU, SUWON-CITY, KYUNGKI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Forming Dual Damascene Interconnection Using Low-K Dielectric Material