Patent Assignment
Reel/Frame 014084/0396
Assignment of Assignor's Interest
Recorded: 2003-05-16
Received: 2003-05-23
Pages: 2
Assignee
RENESAS TECHNOLOGY CORPORATION
4-1, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, JPX, 100-6334, JAPAN
Covered Property
(1)
Method of Manufacturing Semiconductor Device Having Trench Element-Isolating Structure
Application:
10/438,980 →