Patent Assignment
Reel/Frame 014088/0259
Assignment of Assignor's Interest
Recorded: 2003-05-22
Pages: 3
Assignee
STMICROELECTRONICS S.R.L.
VIA C. OLIVETTI, 2, I-20041, AGRATE BRIANZA, ITALY
Covered Property
(1)
Manufacturing Process of an Interpoly Dielectric Structure for Non-Volatile Semiconductor Integrated Memories
Related Assignments
(8)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 18, 2011
From: NUMONYX B.V.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 027075/0682 →
Assignment of Assignor's Interest
Jan 31, 2014
From: STMICROELECTRONICS S.R.L.
To: STMICROELECTRONICS NV
Reel/Frame 032146/0367 →
Assignment of Assignor's Interest
Jan 31, 2014
From: STMICROELECTRONICS NV
To: NUMONYX BV
Reel/Frame 032148/0068 →
Security Interest
May 12, 2016
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 038669/0001 →
Patent Security Agreement
Jun 2, 2016
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 038954/0001 →
Corrective Assignment to Correct the Replace Erroneously Filed Patent #7358718 with the Correct Patent #7358178 Previously Recorded on Reel 038669 Frame 0001. Assignor(S) Hereby Confirms the Security Interest.
Jun 8, 2017
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 043079/0001 →
Release of Security Interest
Aug 23, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 047243/0001 →
Release of Security Interest
Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050937/0001 →