Patent Assignment
Reel/Frame 014165/0721
Assignment of Assignor's Interest
Recorded: 2003-06-11
Pages: 3
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, PALDAL-GU, SUWON-CITY, KYUNGKI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Chip Package Having an Adhesive Tape Attached on Bonding Wires