Patent Assignment
Reel/Frame 014190/0120
Assignment of Assignor's Interest
Recorded: 2003-12-11
Received: 2003-12-11
Pages: 4
Assignor
HITACHI, LTD.
Executed: 2003-09-12
Assignee
REMESAS TECHNOLOGY CORPORATION
4-1, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, JPX, JAPAN
Covered Properties
(2)
Semiconductor Device and a Method of Testing Thereof
Application:
10/614,799 →
High Speed Machine for Inserting Sheets into Envelopes
Application:
10/065,084 →