Patent Assignment
Reel/Frame 014205/0625
Assignment of Assignor's Interest
Recorded: 2003-06-18
Pages: 3
Assignor
MATHEW, RANJAN J.
Executed: 2003-06-17
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95052
Covered Property
(1)
Apparatus and Method Extending Flip-Chip Pad Structures for Wirebonding on Low-K Dielectric Silicon
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.