Patent Assignment
Reel/Frame 014207/0563
Assignment of Assignor's Interest
Recorded: 2003-12-18
Pages: 3
Assignor
KARNEZOS, MARCOS
Executed: 2003-11-21
Assignee
CHIPPAC, INC.
47400 KATO ROAD, FREMONT, CALIFORNIA, 94538
Covered Properties
(2)
Semiconductor multi-package module having package stacked over die-up flip chip ball grid array package and having wire bond interconnect between stacked packages
Application:
10/632,552 →
Publication:
US 2004/0061213
Semiconductor multi package
Application:
60/411,590 →
Related Assignments
(5)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 18, 2003
From: KARNEZOS, MARCOS
To: CHIPPAC, INC.
Reel/Frame 014207/0512 →
Assignment of Assignor's Interest
Dec 18, 2003
From: KARNEZOS, MARCOS
To: CHIPPAC, INC.
Reel/Frame 014207/0515 →
Assignment of Assignor's Interest
Dec 18, 2003
From: KARNEZOS, MARCOS
To: CHIPPAC, INC.
Reel/Frame 014207/0518 →
Assignment of Assignor's Interest
Dec 18, 2003
From: KARNEZOS, MARCOS
To: CHIPPAC, INC.
Reel/Frame 014207/0526 →
Assignment of Assignor's Interest
Dec 18, 2003
From: KARNEZOS, MARCOS
To: CHIPPAC, INC.
Reel/Frame 014207/0608 →