Patent Assignment
Reel/Frame 014207/0526
Assignment of Assignor's Interest
Recorded: 2003-12-18
Pages: 3
Assignor
KARNEZOS, MARCOS
Executed: 2003-11-21
Assignee
CHIPPAC, INC.
47400 KATO ROAD, FREMONT, CALIFORNIA, 94538
Covered Properties
(2)
Semiconductor Multi-Package Module Having Wire Bond Interconnect Between Stacked Packages and Having Electrical Shield
Semiconductor multi package
Application:
60/411,590 →
Related Assignments
(9)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 18, 2003
From: KARNEZOS, MARCOS
To: CHIPPAC, INC.
Reel/Frame 014207/0608 →
Assignment of Assignor's Interest
Dec 18, 2003
From: KARNEZOS, MARCOS
To: CHIPPAC, INC.
Reel/Frame 014207/0512 →
Assignment of Assignor's Interest
Dec 18, 2003
From: KARNEZOS, MARCOS
To: CHIPPAC, INC.
Reel/Frame 014207/0515 →
Assignment of Assignor's Interest
Dec 18, 2003
From: KARNEZOS, MARCOS
To: CHIPPAC, INC.
Reel/Frame 014207/0518 →
Assignment of Assignor's Interest
Dec 18, 2003
From: KARNEZOS, MARCOS
To: CHIPPAC, INC.
Reel/Frame 014207/0563 →
Security Interest
Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Merger and Change of Name
Aug 6, 2015
From: CHIPPAC, INC.; STATS CHIPPAC, INC.
To: STATS CHIPPAC, INC.
Reel/Frame 036286/0612 →
Change of Name
Apr 7, 2016
From: STATS CHIPPAC LTD
To: STATS CHIPPAC PTE. LTE
Reel/Frame 038378/0200 →
Release of Security Interest
Jun 4, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 052844/0491 →