Patent Assignment
Reel/Frame 014223/0340
Assignment of Assignor's Interest
Recorded: 2003-06-30
Pages: 5
Assignor
HARVEY, JOHN PAUL
Executed: 2003-01-10
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
Ball Grid Array Package Construction with Raised Solder Ball Pads
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.