Patent Assignment
Reel/Frame 014232/0998
Assignment of Assignor's Interest
Recorded: 2003-06-24
Pages: 2
Assignor
TANAKA, TAKEKAZU
Executed: 2003-06-12
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI-SHI, KANAGAWA, JAPAN
Covered Property
(1)
A Semiconductor Package Having Encapsulated Chip Attached to a Mounting Plate
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.