IP Library › Assignment 018378/0686
Patent Assignment
Reel/Frame 018378/0686

Assignment of Assignor's Interest

Recorded: 2006-10-04 Pages: 2
Assignor
TANAKA, TAKEKAZU
Executed: 2003-06-13
Assignee
NEC ELECTRONICS CORPORATION
1753, SHIMONUMABE, NAKAHARA-KU, KANAGAWA, KAWASAKI-SHI, JAPAN
Covered Properties (2)
A Semiconductor Package Having Encapsulated Chip Attached to a Mounting Plate
Patent: 7,138,673 →
Application: 10/602,044 →
Publication: US 2004/0082109
Production Process for Manufacturing Such Semiconductor Package
Patent: 7,449,370 →
Application: 11/542,218 →
Publication: US 2007/0090499
Related Assignments (3)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 24, 2003
From: TANAKA, TAKEKAZU
To: NEC ELECTRONICS CORPORATION
Reel/Frame 014232/0998 →
Change of Name Nov 4, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025311/0851 →
Change of Name Dec 22, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025525/0145 →