Patent Assignment
Reel/Frame 025311/0851
Change of Name
Recorded: 2010-11-04
Pages: 9
Assignor
NEC ELECTRONICS CORPORATION
Executed: 2010-04-01
Assignee
RENESAS ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU,, KAWASAKI-SHI, KANAGAWA, 211-8668, JAPAN
Covered Properties
(92)
Memory Control System and Memory Control Circuit
Semiconductor Storage Device
Differential Amplifier Circuit and Semiconductor Device
Semiconductor Device
Integrated Circuit Incorporating Decoupling Capacitor Under Power and Ground Lines
Clock and Data Recovery Circuit
Wireless Receiving Apparatus and Antenna Verification Method
Image Processing Apparatus and Image Processing Method
Semiconductor Device
Apparatus and method for detecting falsification of external data
Application:
11/512,234 →
Publication:
US 2007/0083767
Method of Testing Driving Circuit and Driving Circuit for Display Device
Semiconductor Device
Semiconductor Device and Method of Manufacturing the Same
Semiconductor Device Including Fuse and Method for Testing the Same Capable of Supressing Erroneous Determination
Plasma Processing Apparatus and Method of Suppressing Abnormal Discharge Therein
Semiconductor Memory Device Having a Floating Gate
Selectively Changing Demodulation Modes Depending on Quality of Received Signal or a Control Signal
Display Apparatus Containing Controller Driver with Correcting Circuit and Method of Driving Display Panel
Display Apparatus, and Driving Circuit for the Same
Output Buffer Circuit with Control Circuit for Changing Resistance of Output Resistor Pair
Chip and Multi-Chip Semiconductor Device Using the Chip, and Method for Manufacturing Same
Diversity Reception Circuit
Solid-State Imaging Device and Method of Driving the Same
Method of Forming a Connecting Conductor and Wirings of a Semiconductor Chip
Method for Manufacturing Semiconductor Laser Device and Semiconductor Laser Device
Semiconductor Device and Method for Designing Same
Motor Control Apparatus, Motor Control Circuit, and Method Thereof
Non-Volatile Semiconductor Memory Device
Optical Module with Can Package
Eeprom and Method of Driving the Same
Grayscale Voltage Generating Circuit Providing Control of Grayscale Resistor Current
Communication Cable Connector and Communication Cable
Process for Making a Semiconductor Device Having a Roughened Surface
Semiconductor Device Featuring Large Reinforcing Elements in Pad Area
Semiconductor Integrated Circuit for Reducing Leak Current Through Mos Transistors
Ic Tag, Method of Controlling the Ic Tag, and Ic Tag System
Ic Tag, Ic Tag System, and Method of Executing Command of the Ic Tag
Lsi Design Support Apparatus and Lsi Design Support Method
Pwm Signal Generation Apparatus and Method Thereof and Motor Control Apparatus and Method Thereof
IC tag, IC tag system, and data communicating method for the IC tag
Application:
11/528,380 →
Publication:
US 2007/0069865
Memory Controller
Method of Manufacturing Electronic Circuit Device
Semiconductor Apparatus and Signal Processing System
Semiconductor Device and Method for Manufacturing Same
Booster Circuit
Electronic Device Substrate and Its Fabrication Method, and Electronic Device and Its Fabrication Method
Semiconductor Device and Method for Manufacturing Same
Organic Insulating Film, Manufacturing Method Thereof, Semiconductor Device Using Such Organic Insulating Film and Manufacturing Method Thereof
Output Circuit, Digital Analog Circuit and Display Device
Vertical-Type Metal Insulator Semiconductor Field Effect Transistor Device, and Production Method for Manufacturing Such Transistor Device
Radio Frequency Power Amplifier Circuit
Image encoding apparatus, picture encoding method and image editing apparatus
Application:
11/541,548 →
Publication:
US 2007/0077023
Semiconductor Device
Semiconductor Device and Method for Manufacturing Same
Production Process for Manufacturing Such Semiconductor Package
Method for Manufacturing Semiconductor Device
Package Board and Semiconductor Device
Wiring Board, Semiconductor Device in Which Wiring Board Is Used, and Method for Manufacturing the Same
Multilayered Wiring Board, Semiconductor Device in Which Multilayered Wiring Board Is Used, and Method for Manufacturing the Same
Electronic Circuit Chip, and Electronic Circuit Device and Method for Manufacturing the Same
Method of Manufacturing Semiconductor Device from Semiconductor Wafer
Semiconductor Device-Composing Substrate and Semiconductor Device
Semiconductor Device
Semiconductor Device and Manufacturing Method Thereof
Semiconductor Device Having Improved Metal Wiring
Method of Manufacturing Semiconductor Device
Wiring Board, Semiconductor Device, and Method of Manufacturing the Same
Wiring Structure and Method of Semiconductor Integrated Circuit
Fabrication Method of Semiconductor Device
Transsistor with Heat Dissipating Means
Driver for Liquid Crystal Display
Semiconductor Device with Solder Balls Having High Reliability
Liquid Crystal Display Driver Including a Voltage Selection Circuit Having Optimally Sized Transistors, and a Liquid Crystal Display Apparatus Using the Liquid Crystal Display Driver
Variable Gain Power Amplifier
Display Device, Data Driver Ic, and Timing Controller
Multilayer Wiring Board Capable of Reducing Noise Over Wide Frequency Band with Simple Structure
Application:
11/560,748 →
Publication:
US 2007/0158105
Lcd Panel Drive Adopting Time-Division and Inversion Drive
Semiconductor Chip and Semiconductor Device
Voltage-Pulse Converting Circuit and Charge Control System
Power Supply Apparatus Including Charge-Pump Type Step-Up Circuit Operated at Clock Signal Frequency
Tape Carrier Package Including a Heat Dissipation Element
Method of Manufacturing a Semiconductor Apparatus
Semiconductor Device with Multiple Designation Marks
Semiconductor Device and a Method of Testing the Same
Device and Method for Driving Large-Sized and High-Resolution Display Panel
Light Receiver
Method for Manufacturing Semiconductor Module Using Interconnection Structure
Apparatus and Method for Cleaning Semiconductor Wafer
Semiconductor Device with a Dummy Electrode
Optical Coupling Device with a Detecting Element in the Driver That Provides Uniform Intensity of an Optical Signal
Semiconductor Device
Semiconductor Device
Related Assignments
(18)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 23, 2006
From: KUWABARA, KEIICHI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 018219/0010 →
Assignment of Assignor's Interest
Aug 28, 2006
From: AOKI, YASUSHI; SAEKI, TAKANORI; KIGUCHI, KOICHIRO
To: NEC ELECTRONICS CORPORATION
Reel/Frame 018221/0192 →
Assignment of Assignor's Interest
Aug 28, 2006
From: AOKI, YASUSHI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 018246/0055 →
Assignment of Assignor's Interest
Aug 28, 2006
From: SUDO, NAOAKI; KANAMORI, KOHJI; SANADA, KAZUHIKO
To: NEC ELECTRONICS CORPORATION
Reel/Frame 018221/0532 →
Assignment of Assignor's Interest
Aug 28, 2006
From: OHKUBO, HIROAKI; NAKASHIBA, YASUTAKA
To: NEC ELECTRONICS CORPORATION
Reel/Frame 018245/0049 →
Assignment of Assignor's Interest
Aug 28, 2006
From: SAITO, HIROFUMI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 018244/0326 →
Assignment of Assignor's Interest
Aug 29, 2006
From: HARA, YASUNORI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 018240/0516 →
Assignment of Assignor's Interest
Aug 30, 2006
From: OKUZONO, NOBORU; MORIGAMI, TAKASHI; YASUDA, TSUKASA
To: NEC ELECTRONICS CORPORATION
Reel/Frame 018255/0344 →
Assignment of Assignor's Interest
Aug 30, 2006
From: SATO, KEISUKE
To: NEC ELECTRONICS CORPORATION
Reel/Frame 018253/0590 →
Assignment of Assignor's Interest
Aug 30, 2006
From: KUMAMOTO, KENYA
To: NEC ELECTRONICS CORPORATION
Reel/Frame 018253/0608 →
Assignment of Assignor's Interest
Aug 30, 2006
From: MISHINA, KAZUKI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 018257/0983 →
Assignment of Assignor's Interest
Sep 1, 2006
From: UEDA, TAKEHIRO
To: NEC ELECTRONICS CORPORATION
Reel/Frame 018262/0274 →
Assignment of Assignor's Interest
Sep 1, 2006
From: UEDA, TAKEHIRO
To: NEC ELECTRONICS CORPORATION
Reel/Frame 018262/0259 →
Assignment of Assignor's Interest
Sep 1, 2006
From: KANNO, KIYOSHI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 018263/0476 →
Assignment of Assignor's Interest
Sep 5, 2006
From: HIKITA, TSUNEAKI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 018263/0923 →
Assignment of Assignor's Interest
Sep 5, 2006
From: INAGAWA, OSAMU
To: NEC ELECTRONICS CORPORATION
Reel/Frame 018270/0913 →
Assignment of Assignor's Interest
Nov 20, 2006
From: ITO, NATSUKO; YASAKA, MITSUO; UESUGI, FUMIHIKO; ITAGAKI, YOUSUKE
To: NEC ELECTRONICS CORPORATION
Reel/Frame 018618/0812 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →