Method of manufacturing a semiconductor apparatus

1. A method of manufacturing a semiconductor apparatus, comprising:

forming a low-density body region of a second conductivity type in a surface of a semiconductor substrate of a first conductivity type;

forming a source region of the first conductivity type in the body region;

forming a gate electrode adjacent to the body region via a gate insulating film;

forming an interlayer dielectric over the body region and the gate electrode;

forming a mask pattern over the interlayer dielectric;

forming an opening in the interlayer dielectric using the mask pattern as a mask;

implanting ions to a region of the body region using the mask pattern as a mask to form a high-density body contact region of the second conductivity type; and

removing the interlayer dielectric to extend the opening of the interlayer dielectric using the mask pattern as a mask to form a source contact,

wherein an entire surface of the source region and an entire top surface of the body contact region that is formed by said implantating are leveled with a substantially coplanar surface of the semiconductor substrate.

2. The method of manufacturing a semiconductor apparatus according to claim 1 , wherein the source contact is formed by performing an isotropic etching to remove the interlayer dielectric for a wider range than an opening of the mask pattern.

3. The method of manufacturing a semiconductor apparatus according to claim 1 , wherein the body contact region is formed by implanting an ion after performing an anisotropic etching to remove the interlayer dielectric for almost the same range as the opening of the mask pattern.

4. The method of manufacturing a semiconductor apparatus according to claim 2 , wherein the source contact is formed by removing the gate insulating film for the same range as the interlayer dielectric to be removed.

5. The method of manufacturing a semiconductor apparatus according to claim 3 , wherein the body contact region is formed by removing the gate insulating film for the same range as the interlayer dielectric to be removed.

6. The method of manufacturing a semiconductor apparatus according to claim 1 , wherein the body contact region is formed in a central portion of the body region, and

wherein the source contact is formed around the body contact region.

7. The method of manufacturing a semiconductor apparatus according to claim 1 , wherein the gate electrode is formed in a planar shape over the gate insulating film.

8. The method of manufacturing a semiconductor apparatus according to claim 1 , further comprising:

forming a trench for penetrating the body region from the surface of the semiconductor substrate; and

forming the gate insulating film and the gate electrode inside the trench.

9. The method of manufacturing a semiconductor apparatus according to claim 1 , further comprising:

stopping an etching of the interlayer dielectric over a surface of the semiconductor substrate using the mask pattern as a mask; and

forming the opening in the interlayer dielectric by said etching.

10. The method of manufacturing a semiconductor apparatus according to claim 1 , wherein said source region is unetched.

11. The method of manufacturing a semiconductor apparatus according to claim 1 , wherein said removing of the interlayer dielectric is performed after said implanting.

12. The method of manufacturing a semiconductor apparatus according to claim 1 , wherein etching from said opening forms said region of the body region for said implanting ions by using the mask pattern so that the interlayer dielectric and the gate insulating film over a central part of the low-density body region are removed to expose the low-density body region.

13. The method of manufacturing a semiconductor apparatus according to claim 1 , wherein said surface of said body contact region is confined within said opening prior to said extension of the opening.

14. The method of manufacturing a semiconductor apparatus according to claim 1 , wherein said body contact region is formed within said opening prior to said extension of the opening.

15. The method of manufacturing a semiconductor apparatus according to claim 1 , wherein said body contact region is other than overlapping and is not forming adjacent to said gate insulating film.

16. The method of manufacturing a semiconductor apparatus according to claim 1 , wherein said source region separates said body contact region from said gate insulating film.

17. The method of manufacturing a semiconductor apparatus according to claim 1 , wherein said source contact covers said entire surface of said body contact region.

18. The method of manufacturing a semiconductor apparatus according to claim 1 , wherein said source contact extends within an entire surface of said extended opening of the interlayer dielectric.

19. A method of manufacturing a semiconductor apparatus comprising:

forming a low-density body region of a second conductivity type in a surface of a semiconductor substrate of a first conductivity type;

forming a source region of the first conductivity type in the body region;

forming a gate electrode adjacent to the body region via a gate insulating film, after said forming a gate electrode;

forming an interlayer dielectric over the body region and the gate electrode;

forming a mask pattern over the interlayer dielectric;

forming an opening in the interlayer dielectric using the mask pattern as a mask by etching said interlayer dielectric until said opening reaches said surface of the semiconductor substrate;

implanting ions to a region of the body region using the mask pattern as a mask to form a high-density body contact region of the second conductivity type; and

removing the interlayer dielectric to extend the opening of the interlayer dielectric using the mask pattern as a mask to form a source contact, after said implanting,

wherein an entire top surface of the source region and an entire top surface of the body contact region are leveled with a substantially coplanar surface of the semiconductor substrate, and

wherein said source region separates said body contact region from said gate insulating film.