IP Library Granted Patent US 7,315,058
Granted Patent B2
US 7,315,058 · App. 11/515,000 · Granted Jan 1, 2008

Semiconductor memory device having a floating gate

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Quick Facts
Patent No.
US 7,315,058
App. No.
11/515,000
Granted
Jan 1, 2008
Kind
B2
Abstract

To prevent the extraction of electrons from the floating gate during a read operation. A semiconductor memory device comprises a selection gate 3 a provided in a first region on a substrate 1 through an insulating film 2 , a floating gate 6 a provided in a second region adjacent to the first region through an insulating film 5 , a first and second diffusion regions 7 a and 7 b provided in a third region adjacent to the second region, and a control gate 11 provided over the floating gate 6 a through an insulating film 8 , the control gate 11 intersects with the selection gate 3 a at different levels, a third diffusion region 21 is provided in a fourth region located near an extending part of the selection gate 3 a on the surface of the substrate, the floating gate 6 a is formed in the form of a side wall, and it has a round part 6 b at the top on the side directed to the side wall surface of the selection gate 3 a.

Claims (39)

1. A semiconductor memory device comprising:

a selection gate provided in a first region on a substrate;

a floating gate provided in a second region adjacent to said first region;

first and second diffusion regions provided in a third region adjacent to said second region; and

a control gate provided over said floating gate and a part of said selection gate,

wherein said floating gate is formed in a side wall form on a side wall surface of the selection gate and comprises a round part formed adjacent to said control gate.

2. The semiconductor memory device as defined in claim 1 , wherein said round part is on a side directed to a side wall surface of said selection gate.

3. The semiconductor memory device as defined in claim 1 , wherein a pair of floating gates are provided in a pair of second regions adjacent to said first region,

wherein said first diffusion region and said second diffusion regions are provided in a pair of third regions adjacent to said second regions, respectively, and

wherein said control gate is provided over said pair of floating gates, each of which comprises a round part at the top of said floating gates.

4. The semiconductor memory device as defined in claim 1 , further comprising:

an insulating layer that insulates said floating gate from the substrate and the selection gate.

5. The semiconductor memory device as defined in claim 1 , wherein said round part comprises a curvature radius not less than 10 nm.

6. The semiconductor memory device as defined in claim 1 , wherein said round part is formed on a side of said floating gate that faces said control gate.

7. The semiconductor memory device as defined in claim 1 , further comprising:

a selection gate insulating film formed between said substrate and said selection gate.

8. The semiconductor memory device as defined in claim 7 , further comprising:

a first insulating film formed on said selection gate, and a second insulating film formed on said first insulating film.

9. The semiconductor memory device as defined in claim 8 , further comprising:

a third insulating film formed on said second insulating film and between said round part and said control gate.

10. The semiconductor memory device as defined in claim 9 , further comprising:

a tunnel insulating film formed between said floating gate, and a side wall of said selection gate, said first insulating film and said second insulating film.

11. The semiconductor memory device as defined in claim 1 , wherein said selection gate comprises a plurality of comb tooth-shaped portions.

12. The semiconductor memory device as defined in claim 11 , wherein said comb tooth-shaped portions of said selection gate are interlocked with comb tooth-shaped portions of another selection gate.

13. The semiconductor memory device as defined in claim 12 , wherein said first and second diffusion regions are disposed along a direction in which said comb tooth-shaped portions extend, and

wherein said first and second diffusion regions comprise a drain region during a write operation and a source region during a read operation.

14. The semiconductor memory device as defined in claim 11 , wherein said control gate extends in a direction perpendicular to said comb tooth-shaped portions, and controls a channel in a region between said selection gate and said first diffusion region.

15. The semiconductor memory device as defined in claim 1 , wherein said round part inhibits an extraction of electrons from said floating gate during a read operation.

16. A semiconductor memory device comprising:

a selection gate provided in a first region on a substrate;

a floating gate provided in a second region adjacent to said first region;

first and second diffusion regions provided in a third region adjacent to said second region; and

a control gate provided over said floating gate,

wherein said floating gate is formed in a side wall form and comprises a round part formed adjacent to said control gate and on the side directed to a side wall surface of said selection gate.

17. The semiconductor memory device as defined in claim 16 , wherein a pair of floating gates are provided in a pair of second regions adjacent to said first region,

wherein said first diffusion region and said second diffusion regions being provided in a pair of third regions adjacent to said second regions, respectively, and

wherein said control gate is provided over said pair of floating gates, each of which comprises a round part at the top of said floating gates.

18. The semiconductor memory device as defined in claim 16 , further comprising: an insulating layer that insulates said floating gate from the substrate and the selection gate.

19. The semiconductor memory device as defined in claim 16 , wherein said round part comprises a curvature radius not less than 10 nm.

Assignments (3)
CHANGE OF ADDRESS Recorded Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →
CHANGE OF NAME Recorded Nov 4, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025311/0851 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 5, 2006
From: HIKITA, TSUNEAKI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 018263/0923 →